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140-502-415-001

Name: EDAC 140-502-415-001
Brand: EDAC
SKU: 587-140-502-415-001
Price: 0.08 EUR
Availability: InStock

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Ürün Teknik Özelliklerine Bakın

Mouser Numarası:

587-140-502-415-001

Ürt. Numarası:

140-502-415-001

Ürt.:

EDAC

Açıklama:

Başlıklar ve Kablo Muhafazaları 140 Series Wire to Board in-line 2.0mm pitch connector with 2 P.C. board through hole contacts, top entry, kinked contacts

Veri Sayfası:

140-502-415-001 Veri Sayfası (PDF)

ECAD Modeli:

Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Daha Fazla Bilgi

EDAC 140-502-415-001 hakkında daha fazla bilgi edinin

Stokta Var: 2.927

Stok:: 2.927

Hemen Gönderilebilir

Beklenmeyen bir hata oluştu. Lütfen daha sonra tekrar deneyin.
Siparişte:: 1.900
Fabrika Teslim Süresi:: 16

Hafta Gösterilenden daha büyük miktarlar için fabrikada tahmini üretim süresi.

Miktar Girin:

Minimum: 1 Çoklu: 1

Birim Fiyat:

-,-- €

Toplam Fiyat:

-,-- €

Tahmini Gümrük Vergisi:

Fiyatlandırma (EUR)

Miktar	Birim Fiyat	Toplam Fiyat
	0,086 €	0,09 €
	0,05 €	0,50 €
	0,044 €	1,10 €
	0,042 €	4,20 €
	0,037 €	9,25 €
	0,035 €	35,00 €
	0,034 €	85,00 €

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Ürün Niteliği	Öznitelik Değeri	Özellik Seçin
Üretici Firma:	EDAC
Ürün Kategorisi:	Başlıklar ve Kablo Muhafazaları
RoHS:
Ürün:	Headers
Tip:	Shrouded
Pozisyon Sayısı:	2 Position
Saha:	2 mm (0.079 in)
Satır Sayısı:	1 Row
Montaj Stili:	PCB Mount
Sonlandırma Stili:	Solder Pin
Montaj Açısı:	Straight
Kontak Cinsiyeti:	Pin (Male)
Kontak Kaplama:	Tin
Seri:	140
Uygulama:	Wire-to-Board
Minimum Çalışma Sıcaklığı:	- 40 C
Maksimum Çalışma Sıcaklığı:	+ 105 C
Marka:	EDAC
Kontak Malzemesi:	Brass
Montaj Ülkesi:	Not Available
Dağıtım Ülkesi:	Not Available
Menşe Ülke:	CN
Akım Oranı:	2 A
Yanıcılık Derecesi:	UL 94 V-0
Muhafaza Rengi:	Natural
Muhafaza Materyalleri:	Polyamide (PA)
Yalıtım Direnci:	1 GOhms
Ürün Tipi:	Headers & Wire Housings
Fabrika Paket Miktarı:	1
Alt kategori::	Headers & Wire Housings
Voltaj Derecesi:	100 V

Bulunan ürünler:

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Bu kategorideki benzer ürünleri göstermek için yukarıda en az bir onay kutusu seçin.

Seçilen özellikler: 0

Belgeyi Filtrele:

Bu işlev için JavaScript'in etkinleştirilmesi gerekir.

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Medical Interconnect Solutions

EDAC offers a comprehensive range of connectors and cable assemblies designed for medical applications. Featured products include card edge connectors for signal and power delivery in blood analyzers, header connectors for facilitating multi-board solutions, in-line connectors for ensuring reliable wire-to-wire and wire-to-board connections, and rugged in-line, D-Sub, USB, and HDMI connectors for IP-rated protection. The IP-rated connectors are EMI-shielded and prevent dust, debris, and moisture ingress, which enhances patient care and diagnostic accuracy while meeting stringent regulatory standards. These EDAC connectors and cable assemblies are ideal medical interconnect solutions, such as ambulances, medical rooms, ventilators, and CPAP machines.

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.