A17553-125

Laird Technologies
739-A17553-125
A17553-125

Ürt.:

Açıklama:
Termal Arayüz Ürünleri COOLZORB-400,0.125in

ECAD Modeli:
Bu dosyayı ECAD Aracınız için dönüştürmek için ücretsiz Library Loader dosyasını indirin. ECAD Model hakkında daha fazla bilgi edinin.

Stok Durumu

Stok:
0

Bu ürünü hâlâ tekrar siparişle satın alabilirsiniz.

Fabrika Teslim Süresi:
4 Hafta Gösterilenden daha büyük miktarlar için fabrikada tahmini üretim süresi.
Minimum: 1   Çoklu: 1
Birim Fiyat:
-,-- €
Toplam Fiyat:
-,-- €
Tahmini Gümrük Vergisi:

Fiyatlandırma (EUR)

Miktar Birim Fiyat
Toplam Fiyat
317,04 € 317,04 €
293,19 € 2.931,90 €
277,38 € 6.934,50 €

Ürün Niteliği Öznitelik Değeri Özellik Seçin
Laird Technologies
Ürün Kategorisi: Termal Arayüz Ürünleri
RoHS:  
Thermal and EMI Absorbers
Absorbing Sheet
Non-standard
2 W/m-K
Gray
- 40 C
+ 175 C
457.2 mm
457.2 mm
3.17 mm
UL 94 V-0
COOLZORB
Bulk
Marka: Laird Technologies
Montaj Ülkesi: Not Available
Dağıtım Ülkesi: Not Available
Menşe Ülke: US
Ürün Tipi: Thermal Interface Products
Fabrika Paket Miktarı: 1
Alt kategori:: Thermal Management
Ticari Unvan: COOLZORB
Birim Ağırlık: 3,640 kg
Bulunan ürünler:
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Seçilen özellikler: 0

CNHTS:
8517709001
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

CoolZorb 400 Hybrid Thermal Transfer/EMI Absorber

Laird Technologies CoolZorb 400 Hybrid Thermal / Electromagnetic Interference (EMI) Absorbers suppress unwanted energy coupling, resonances, or surface currents with a 4.5g/cc density. This hybrid absorber / thermal management material is used as a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or a metal chassis. Laird Technologies designs the material using a silicone gel binder that imparts inherent tack typical of standard thermal gap fillers. The filler particle composition provides both good thermal conductivity and EMI suppression in the microwave frequency range, with ideal attenuation performance at or above 5GHz. The soft, compliant pad exerts minimal stress on mating components during assembly while providing good thermal transfer properties due to low interfacial resistance.

CoolZorb Hybrid Thermal EMI Absorbers

Laird Technologies CoolZorb Thermal Interface is a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or a metal chassis. Laird CoolZorb suppresses unwanted energy coupling, resonances, or surface currents, causing board-level EMI issues. The hybrid absorber/thermal management material of the CoolZorb series is designed using a silicone gel binder that imparts inherent tack, typical of standard thermal gap fillers. The filler particle composition imparts thermal conductivity and EMI suppression in the microwave frequency range with high attenuation performance at or above 3GHz. CoolZorb passes UL 94V-0 requirements and is RoHS and REACH compliant.