HHM1927A4

TDK RF Diplexers

Cellular LTE Products

TDK Cellular LTE products include a variety of components for LTE modems and various filters for LTE communications. LTE Long Term Evolution, developed by 3GPP, is the successor to 3G UMTS and HSPA. This standard provides a much higher data rate, sets the foundation for 4G LTE Advanced, and paves the way for 5th generation technologies. TDK works with various cellular phone chip makers and their end customers to design a variety of components for LTE modems such as diplexers, triplexers, baluns, couplers, and various filters to accommodate the ever-increasing number of communication bands used in carrier aggregation features of LTE.

RF Components

TDK RF Components include a large selection of antennas, diplexers, triplexers, baluns, filters, and couplers designed for cellular phones, wireless LAN, and BLUETOOTH^®. To meet the ever-increasing demand for compact, slim, lightweight, and high-performing components, TDK RF components make full use of material technologies such as ferrites and ceramics and thin-film technologies. TDK RF components provide leading-edge miniaturization technology while providing exceptional electrical characteristics and are recommended by leading WLAN chipset manufacturers for 2.4GHz and 5GHz WLAN.

RF Baluns

TDK RF Baluns offer an extensive range of SMD/SMT models with various impedances ranging from 50 to 200Ω. The passive baluns are available in 0603 (1608 metric), 0402 (1005 metric), and 0805 (2012 metric) case sizes, operating from -40°C to +85°C temperatures. TDK multilayer chip transformer baluns are useful in applications such as cellular phones, wireless LAN, and BLUETOOTH®. These baluns are constructed with low temperature co-fired ceramics (LTCC), converting signals from balanced to unbalanced, and vice versa. TDK RD Baluns provide leading edge miniaturization technology while providing exceptional electrical characteristics for 2.4GHz and 5GHz WLAN.

HHM Baluns

TDK HHM Baluns are designed to meet the growing demands for compact, slim, lightweight, and high-performing components. The HHM Series uses material technologies such as ferrites and ceramics in thin-film technology. TDK Baluns provide leading-edge miniaturization technology while providing exceptional electrical characteristics for 2.4GHz & 5GHz WLAN. Applications include telecommunication, wireless LAN, and BLUETOOTH®.

RF Couplers

TDK RF Couplers offer multiple types of directional couplers, including the HHM Series Multilayer Chip Directional Couplers for LTE/GSM/DCS/PCS and the TFS Series Couplers. The HHM29xxxx Series includes a variety of coupling characteristics and frequency ranges, including the HHM2909C4 that offers four frequency ranges from 777MHz to 1910MHz, coupling factor range from 12.8±1.0dB to 20.4±1.0dB, and operating temperature range from -40°C to +85°C.